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Plasma-Enhanced Chemical Vapor Deposition of Two-Dimensional Materials for Applications 期刊论文
ACCOUNTS OF CHEMICAL RESEARCH, 2021, 卷号: 54, 期号: 4, 页码: 1011-1022
作者:  Yi, Kongyang;  Liu, Donghua;  Chen, Xiaosong;  Yang, Jun;  Wei, Dapeng;  Liu, Yunqi;  Wei, Dacheng
收藏  |  浏览/下载:224/0  |  提交时间:2021/04/06
Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation 期刊论文
NATURE COMMUNICATIONS, 2019, 卷号: 10, 页码: 11
作者:  Liu, Donghua;  Chen, Xiaosong;  Yan, Yaping;  Zhang, Zhongwei;  Jin, Zhepeng;  Yi, Kongyang;  Zhang, Cong;  Zheng, Yujie;  Wang, Yao;  Yang, Jun;  Xu, Xiangfan;  Chen, Jie;  Lu, Yunhao;  Wei, Dapeng;  Wee, Andrew Thye Shen;  Wei, Dacheng
Adobe PDF(3903Kb)  |  收藏  |  浏览/下载:247/0  |  提交时间:2019/04/18
Solvent-Free Process to Produce Three Dimensional Graphene Network with High Electrochemical Stability 期刊论文
JOURNAL OF PHYSICAL CHEMISTRY C, 2017, 卷号: 121, 期号: 5, 页码: 3062-3069
作者:  Xia, Dongyun;  Yi, Kongyang;  Zheng, Baozhong;  Li, Menglin;  Qi, Guoqiang;  Cai, Zhi;  Cao, Min;  Liu, Donghua;  Peng, Lan;  Wei, Dapeng;  Wang, Zhen;  Yang, Lei;  Wei, Dacheng
Adobe PDF(512Kb)  |  收藏  |  浏览/下载:120/0  |  提交时间:2018/03/15