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Abnormal grain growth in thin copper foils during high-temperature annealing
Guo,J1; Zhang,C L2; Li,X3,4; Huang,T L1; Wu,G L5; Shi,H F3,4; Jensen,D Juul6; Huang,X X1
2023-11-01
摘要Abstract We investigate grain growth at 1000 °C, a critical temperature for abnormal grain growth in copper foils. By ex-situ annealing experiments at 1000 °C, it is found that abnormal grains grow through the entire sample thickness, forming a polycrystalline structure with a single layer of grains. The migration of the boundaries surrounding the abnormally large grains are characterized by optical microscopy and electron backscatter diffraction. The migration rates are found to vary significantly from place to place, which is analysed based on boundary characteristics, i.e., misorientation and boundary curvature, and the size distribution of the neighbouring grains.
DOI10.1088/1742-6596/2635/1/012035
发表期刊Journal of Physics: Conference Series
ISSN1742-6588
卷号2635期号:1
WOS记录号IOP:JPCS_2635_1_012035
语种英语